C70250

CHEMICAL COMPOSITION

Ni %

Si %

Mg %

Cu %

3

0.65

0.15

Rem.

 

Physical properties

Density (g/cm3)

8.8

Conductivity at 20°C (% IACS)

45

Thermal conductivity  at  20°C (W/(m · K))

190

Specific heat (J/(g · K))

0.399

Elastic Modulus (MPa)

130

Thermal expansion coefficient (10-6/ K)

17.6


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